/build-paths
From open design to qualified module.
MOMF coordinates six stages. Each stage is run by a different class of supplier, but the handoffs are standardized so a design doesn't need bespoke engineering at every step.
- 01
Open Design
Downloadable ZIP build package: RTL, layout, manifest, test plan.
- 02
Build Manifest
Machine-readable DESIGN_MANIFEST.yaml drives the rest of the pipeline.
- 03
Supplier Matching
Packaging, test, calibration, module assembly routed by capability.
- 04
Brownfield Node
ESD-safe assembly, burn-in, and reliability in converted Rust Belt cells.
- 05
Certified Module
Serialized, calibrated, ruggedized — meets a published MOSX-MOD profile.
- 06
Vertical Integration
Module → OEM → field. Returns feed the evidence ledger.
From design to packaged chip
A design submits a DESIGN_MANIFEST.yaml with a process node, package options, and test/calibration plans. MOMF matches it to a foundry (mature-node, MPW-compatible), then to a packaging house qualified for the target package format (QFN / QFP / BGA / ceramic). Wafer probe results, bond diagrams, and outgoing-test logs travel with the lot.
From packaged chip to rugged module
The reference module under module_reference_design/ defines a carrier PCB matched to a MOSX-MOD profile. A regional EMS handles SMT, selective solder, connectorization, and conformal coat. The calibration provider runs trim and writes signed records.
From module to qualification
A reliability lab runs the screening profile from RELIABILITY_PLAN.md — thermal cycling, HTOL, vibration (rugged profile), humidity, and ESD. The result is a Reliability Evidence Bundle attached to the supplier's MOMF record and the design's maturity-status upgrade.
Cost and timeline estimator
v0 of MOMF publishes a static cost/timeline range per recipe (see /recipes). v1 will replace this with a parametric estimator driven by the manifest plus current supplier capacity.